Industry · thin · clean removal · EMI · optical
Electronics & Display
Solder masking, EMI grounding, display lamination, light blocking and ESD-safe protection in assemblies measured in micrometres.
Typical tasks
- Wave-solder and conformal-coating masking with residue-free removal
- EMI shielding and grounding on FPC, connectors and cable runs
- Optical lamination of touch panels and display modules
- Light blocking at backlight edges and camera modules
- ESD-safe temporary protection of boards between processes
Before we quote, we need
- Process step and chemical exposure
- Required transmittance, haze or resistivity
- Component size and cut tolerance
- Cleanroom class and packaging requirement
Selection warnings
Warnings here are the failure modes we see most often in this industry, not disclaimers.
Optical grades are specified by transmittance and haze together; a single number hides the failure mode.
Conductive adhesive resistivity is direction-dependent — Z-axis and surface values are not interchangeable.
Thin PET and PI backings curl at the edge after slitting; width tolerance and roll orientation must be agreed.
Products that cover this industry
Lightweight overlap sealing and low-mass fixing where a full aluminum foil backing is thicker than needed.
Cryogenic-compatible electrical insulation and high-temperature masking where a thin, dimensionally stable backing is required.
Solder masking, wave-solder protection, coil and transformer insulation, and 3D-print bed surfaces.
Powder-coating masking, PCB plating and conformal-coating protection, and heat-transfer printing.
Bonding of components, display modules, labels and fixtures where two different surfaces must be joined.
Thin, gap-free bonding of film, foil and paper where a carrier backing would add unwanted thickness.
Grounding, EMI shielding, static discharge paths and RF gasketing in electronics assemblies.
Flexible EMI shielding of cables, FPC and connectors where repeated flexing would crack foil.